Micro I Dispense System
Heated Stand-alone Dispense System
| Micro I |
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| Product Sheet (pdf) |
| Standard Features |
| Applications |
| Specifications |
| Series Comparisons |
| Request further details |
Ideal for Batch Production or Lab Processes
This dispense system is ideal for dispensing conductive materials and microelectronic liquid encapsulant for ball grid arrays, multi-chip modules, chip-on-board and flip chip applications.
Complete control is provided for batch production or lab processes utilizing multi-tasking software with superior vision technology.
Standard Features
- Welded Steel Frame
- Positioning Accuracy ± 0.0015" (± 0,0381 mm)
- Dispense Area Up to 18" x 14" (457 mm x 355 mm)
- Station 1 Tool-less Taper-Lock Mounting Hardware
- Up to 3 Configurable Valve/Tool Mount Stations
- Optional Heated Work Area with Vacuum up to 150° C
- Camera & Gantry Heat Protection Area
- Automatic Vision Alignment System (Cognex based) and Pattern Recognition Trainer
- Red/Blue Illuminator
- Contact Surface Sensor with 0.050" (1,27 mm) Tip and less than 5 grams of force
- Auto Calibration Station for automatic X,Y,Z needle calibration
- Needle Cleaner
- Heat and Vacuum Control Module
- Adjustable Keyboard Mount
- TCP/IP Network Ready
- Second Internal Hard Drive for Backups
- 4" (102 mm) Ventilation Stack with Fan
- Interior Lighting
- Interlocked Safety Barriers for Operator Safety
- X-Y-Z Brushless Servo Motors with Precision Ball Screws
- Linear Speed up to 20 inches/second (508 mm/second)
- 3-Color Status Light Tower
- Pentium PC and Color, Flat Panel Monitor
- Easy Access Electronics Drawer
- Easy Programming of dots, lines, fills, arcs, etc. with GPD Global FLOware Operating Software
- Real-Time Editor while system is in production
- Start Up & Leveling Kit
- 1 CD copy of DS Series Documentation for Installation, Operation, and Maintenance
- CE Declaration of Conformity
Applications^
Click here to view our chart of Fluid Dispense Applications by dispense system.
Specifications^
| Description | Details |
|---|---|
| Configurations | Stand-alone System with Heated Dispense Plate |
| Work Area | From 14.4" x 14" (366 mm x 356 mm) to 18" x 14" (457 mm x 355 mm) |
| Dispense Rate* | 28,000 dots per hour (adhesive) |
| Linear Speed | 20 inches/second (508 mm/sec) |
| Positioning Accuracy** | ±0.0015" (± 0,038 mm) |
| Repeatability*** | ±0.0006" (± 0,0152 mm) |
| Temperature Range | Ambient to 150 ° C |
| XYZ Drive | Precision Ball Screw Drive with Linear Rails and closed-loop encoder feedback |
| Valve Stations (maximum) | Up to 3 working valve mounts |
| Power | 230 VAC 50/60 Hz |
| Footprint | 67"W♦ x 57.5"D♦♦ x 77"H (170 cm W♦ x 146 cm D♦♦ x 196 cm H) |
| Weight (approximate) | 1,700 lb (771 kg) |
| * Based on speed test of 1,000 dot pattern at 0.050" (1,27 mm) spacing with certain SMT adhesive materials, at 0.020" (0,508 mm) dot diameter. ** With System Mapping over 12" x 12" (305 mm x 305 mm) dispense area. *** Per axis. ♦ Width includes a standard monitor mounted on a swivel arm. ♦♦ Depth includes the monitor on swivel arm in its fully extended position. |
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Designed, manufactured, assembled, and tested in the USA.