MAX II Series Dispense Systems
Heated, High Precision, Fluid Dispense System Models
| MAX II Series Dispensers | Product Sheets MAX II Series (pdf) MiniMax II (pdf) MicroMax II (pdf) |
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The MAX II Series of fluid dispense systems, designed primarily for high volume underfill and the encapsulation process in compact/shortened production lines, incorporates innovative dispense techniques, an optimized heating and transport system, and process monitoring features.
The fluid dispense systems included in this series are the MiniMax II with its single valve station, suiting it more for underfill; and the MicroMax II which has two valves stations, making it the choice for applications requiring multiple materials. Click here to further compare the MAX II Series models and find the model that best suits your needs.
Features
MAX II Series dispense systems maintain the heart of the MicroMax while incorporating new and innovative dispense technology, optimized heating and transport, sleuth-like vision alignment, and process monitoring features such as temperature control and weight calibration. All of these features combined with the long time standards - fully automatic calibration, tool-less Taper-Lock mounting hardware, unibody frame, and, of course, functionality - make your production fast, easy, and worry-free.
- The combination of a unibody frame with ballscrew and servo motor drive yields an accuracy of ±0.001" (25 micron) at linear speed up to 30"/sec (768 mm/sec).
- The re-configuration of the components on this frame have resulted in a reduced footprint.
- When equipped with pre- and post-heating systems, system width is now reduced nearly 25% at 52" (1.3 m).
- The workarea of the MiniMax II with a single valve is larger at 13.7" x 12" (348 mm x 305 mm), while the MicroMax II maintains 12" x 12" (305 mm x 305 mm) to easily accommodate common substrate carriers and bar PCBs.
Substate Heating
Temperature monitoring is critical when substrates are fed to the system from various sources. A rack of products coming from inspection may be at room temperature while products coming directly from an oven will already be at an elevated temperature.
Substrate heating has been improved with the introduction of lifter plates in the pre- and post-heat zones. By incorporating lifter plates, custom fixtures and heating may now be used throughout the system. During the pre-heat process it is critical not to overheat the substrate. An overheated substrate may yield unsatisfactory dispense results and lead to product failure. To ensure a consistent pre-heating process, a Temperature Monitoring Sensor can be incorporated that monitors the temperature of the substrate during pre-heating. If the substrate reaches process temperature before the pre-heat cycle is complete, heat will be removed and the substrate transferred to the next station.
Optimized Dual Speed Conveyor
An optimized dual speed conveyor enhances product tranport. Dual speed transport allows products to be transferred at a high rate of speed over the long distance between stations, slowing just before the substrate reaches the board stop. By reducing the speed before the board stop, the substrate is gently stopped, avoiding shock to the product being transported. This transition prevents the loss of product before it's even processed.
FullView Illumination
The alignment process required to locate and align each die once the substrate reaches the workarea can be very tricky when silicon dies are used because the surface texture and finish can vary from unit to unit or from lot to lot. It is these variations that can make finding a die with a standard illumination system very difficult. The MAX II Series incorporates the FullView Illumination system. This illumination system combines a low angle dark field light with a standard top down source. By coupling these two illumination sources and allowing them to be controlled independently, there isn't a die that can't be found.
If the vision system is unable to locate a die using the default lighting, it will automatically change to a different illumination configuration and search again. The result is a stop-free and reliable production process where the operator need not assist the system with alignment nor gather "unfound" die and re-run them in a special process.
Laser Surface Sensor
The use of a laser surface sensor is recommended with the MAX II Series because most products handled by this system should not be touched in order to avoid possible contamination.
