Reliable Flip Chip Assemblies
| Flip Chip |
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| Application Sheet (pdf) |
| Technical Article (pdf) |
| Recommended systems |
Precise Control of Underfill Deposition is Critical to Stable On-Board Attachment Technologies
The demand for denser assemblies in recent years has led to increased use of flip chip ball grid array (FCBGAs), direct chip attach (DCA), chip scale package (CSP) and chip-on-flex (COF) technologies to reduce footprint and thickness of the chip assembly (as much as 50 percent thinner than wire-bonded chip packages).
Equally important is improving the reliability of packaged devices, and increasing processing speeds. In fact, PCB assemblers utilize one of these newer assembly methods for almost all PCBs in order to meet the demand for smaller, more portable electronic products ...more (pdf)