SMT Adhesive
High Speed Processing
Double-sided processing and extra holding power for larger components
| SMT Adhesive |
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| Application sheet (pdf) |
| Recommended systems |
SMT Adhesive is a very well defined process for dispensing systems. It can nearly be called the first real process for dispensing systems beginning in the mid 1980’s. This process step is used to hold components on a substrate that require double sided processing. Additionally, it is used to add extra holding power for larger components that are exposed to high shock environments.
The GPD Global MAX Series and DS Series dispense systems are well suited to Adhesive or Solder Paste dispensing. Both systems are available in standalone or inline configurations.
The DS Series equipment is recommended for products that require a work area up to 24” x 24” (609 mm x 609 mm) and also for applications that require versatility in process; that is, multiple materials on the same substrate or high mix production. Theoretical maximum dispense rates for the DS Series are at 28,000 dph with actual throughputs in the range of 20,000 dph for SMT Adhesive.
The MAX Series has been designed as a true production system, from the unibody frame to the redesigned gantry. MAX Series systems are able to keep pace with the fastest of Pick and Place systems. For single material applications, the MiniMax is the perfect choice with an expanded work area of 13.7” x 12” (348 mm x 305 mm) and a lower price than a fully-configured MicroMax.
Maximum throughputs for the MAX Series using NCM (Non Contact Metering) technology yields throughput of more than 40,000 dph. When equipped with an auger valve, maximum rates are an impressive 36,000 dph with actual throughputs of more than 25,000 dph for surface mount adhesive. ... more (pdf)
