Micro Dispensing Comes of Age
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Semiconductor dot diameters of 10 mils and under mandate an "Integrated Engineering" approach
As the technology for electronic products such as cell phones, pagers, and hand-held computers continues to evolve, flex circuits and printed circuit boards (PCBs) within these products are becoming more densely populated with faster and ever smaller chips and packages.
While designers look for ways to accommodate circuitry on shrinking real estate, manufacturers face the particular challenge of depositing solder paste, conductive epoxies, and underfills in extremely precise patterns for mounting ultra fine pitch leaded devices, ball grid arrays (BGAs), chip scale packages (CSPs) including micro BGAs and flip chips, and direct chip attach (DCA) components. ...more (pdf)