Encapsulation: Dam & Fill, Glob Top
Fluid Encapsulation Protects Electronic Components
| Fluid Encapsulation |
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| Application Sheet (pdf) |
| Technical Article (pdf) |
| Recommended systems |
Complex Dispensing Process Requires Precise Control of Many Variables
Encapsulation processes are used to protect fragile die or wire bonds. There are two primary processes used to achieve the encapsulation. Dam and Fill is a precise method of encapsulating high I/O count, wire bonded die. Without the encapsulation, wire bonds would be exposed and subject to damage, rendering the product useless. Dam and fill is a two-part process consisting of a dam being dispensed first, followed by fill material.
As an alternative to dam and fill, a glob top process can be done or a cavity fill process can be done depending on the product layout. Glob top differs from dam & fill in that it does not utilize a dam, thus leaving the encapsulation with a domed shape and a lesser defined border. Cavity fill processes will fill a packet to creat a flat surface. Typically, glob top is used on low cost products and when the wetted area is not critical.
A successful encapsulation process results in complete encapsulation of wire bonds void of air entrapment. ...more (pdf)