Fluid Dispensing Applications
Precision fluid dispensing systems for low-volume, high-mix, R&D, and High Volume 24 x 7 production. Applications include Micro Volume dots and lines, Underfills, Encapsulations, Lens Fixing, Masks, and more.
SMT
Simple-to-advanced Fluid Dispensing applications for PC Board, Hybrid, & High
Density Interconnect, Adhesives,
Glob-top,
Underfill, Solder Paste, Solder Mask,
and Potting.
Recommended: MAX Series,
MicroCell,
DS9000, or DS9100.
Semiconductor
Micro Electronics
Simple-to-advanced fluid dispensing applications for BGA (for example,
FCBGA and
PBGA), micro BGA, COB,
Flip Chip, SiPs,
and other CSP applications. Encapsulants,
Underfill,
Conductive Epoxies, Non-conductive Epoxies,
Lid Attach, Back-end Packaging, and
Heat Dissipater Attach.
Recommended: MAX Series,
MAX II Series, Micro I, or
Micro II.
Table Top
Low cost, low volume production, table top system with an innovative, human
programming interface. Large board capability. Single valve capacity.
Recommended:
T-Max.
Specific Applications
View category-specific application charts (see links listed below) or an EXTENSIVE CHART of fluid dispensing categories and the recommended equipment for each.
If your application is not listed, contact us; our expansive equipment line can meet your needs.
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